Welcome to Entech Electronics Inc

Contract Assembly imageContract Assembly

Entech Electronics China provide a comprehensive range of quality accredited contract manufacturing and product assembly services to the International electronics industry. Our in-house and contract partners include the following capabilities:

Component Procurement & Management Service

  • Domestic and International supply lines.
  • Procurement teams in Shenzhen and Australia.
  • Customs arrangements and documentation for importation of client supplied components (FIA) available.
  • Sourcing of wire looms, including over moulds and semi rigid moulding, all custom and commodity cables.
  • Metal fabrication, casting and extrusion, including all finishes and pad printing.
  • Plastics tooling and manufacture.


 Assembly facilities


  • Entech partners with 4 assembly facilities as well as in-house capabilities to provide any volume requirement.
  • Lead free processing.
  • Through Hole Assembly Lines.
  • Dual Wave, Wave Soldering machine.
  • Fine Pitch QFP to .02" (0.5mm).
  • BGA to .01" (0.3mm).
  • Chip components 0201.
  • PCB size 1.18"-20" (30-510mm).
  • Mixed technology assembly.
  • Mechanical and box build assembly.




  • MDA (Bed of Nails using HP3065 & HP3070).
  • Full functional testing using dedicated Jigs and fixtures.
  • Functional testing (Teradyne A360, Geotester).
  • X-Ray and Optical inspection facility for BGA placement.
  • PC based test systems (Dedicated, JTAG/Boundary Scan).


Turnkey product manufacturing


  • Total product build.
  • Packaging and warehousing including manuals, CDs, literature and cartons.
  • Shipping direct to the end user.


Other services


  • Design advice on suitability for manufacture (DFM).
  • Engineering support including PCB layouts and design.
  • Production tooling and test jig design and manufacture.